METHOD OF SOLDERING PARTS OF TELESCOPIC ARTICLES Russian patent published in 1998 - IPC

FIELD: soldering of telescopic articles in any industry branches for precise joining of parts. SUBSTANCE: telescopic article is assembled of outer envelope and inner envelope with rigidity ribs on its outer surface. Before applying coat gap between inner surface of outer envelope and rigidity rib of inner envelope is controlled for its uniformness. In order to realize it plastic material is applied onto inner surface of outer envelope. Parts are subjected to pressure up to their final setting. Then said envelopes are disconnected. Indentation values in plastic material allow to evaluate uniformness of said gap. Plastic material may be paste-like chalk solution or modeling clay. Then plastic material is removed and coat is applied on surfaces of parts. Solder is placed onto surfaces to be soldered. Parts are assembled, soldered and cooled. EFFECT: enhanced efficiency. 3 cl