FIELD: polymeric materials, more particularly sealing of radioelectronic equipment. SUBSTANCE: filling compound comprises, wt.pts: epoxidated rubber (specifications 38.403550-90), 100; and xylilene diamine, 8-14. The compound has stable operating characteristics at elevated temperature. EFFECT: wider use of the filling compound at elevated temperatures. 1 tbl
Title | Year | Author | Number |
---|---|---|---|
ELECTRICAL INSULATING PILLING AND IMPREGNATION COMPOUND | 2022 |
|
RU2787124C1 |
ELECTRIC INSULATING FILLING-IMPREGNATING COMPOUND | 2017 |
|
RU2672094C1 |
FOAM COMPOUND COMPOSITION (OPTIONS) | 2002 |
|
RU2224001C1 |
ADHESIVE EPOXIDE COMPOSITION | 2001 |
|
RU2188840C1 |
COLD-CURED EPOXY COMPOSITION | 2018 |
|
RU2749379C2 |
COLD-CURED EPOXY BINDER | 2018 |
|
RU2749380C2 |
ELECTRICAL EMBEDMENT COMPOUND | 2007 |
|
RU2343577C1 |
EPOXY COMPOSITION | 2007 |
|
RU2345106C1 |
INSULATING COMPOUND | 0 |
|
SU1756942A1 |
PREPREG BASED ON ADHESIVE BINDER OF REDUCED FLAMMABILITY AND FIBERGLASS, CARBON FIBER ON ITS BASIS | 2018 |
|
RU2676634C1 |
Authors
Dates
1998-10-27—Published
1995-07-17—Filed