FIELD: polymeric materials, more particularly sealing of radioelectronic equipment. SUBSTANCE: filling compound comprises, wt.pts: epoxidated rubber (specifications 38.403550-90), 100; and xylilene diamine, 8-14. The compound has stable operating characteristics at elevated temperature. EFFECT: wider use of the filling compound at elevated temperatures. 1 tbl
| Title | Year | Author | Number | 
|---|---|---|---|
| ELECTRICAL INSULATING PILLING AND IMPREGNATION COMPOUND | 2022 | 
 | RU2787124C1 | 
| ELECTRIC INSULATING FILLING-IMPREGNATING COMPOUND | 2017 | 
 | RU2672094C1 | 
| FOAM COMPOUND COMPOSITION (OPTIONS) | 2002 | 
 | RU2224001C1 | 
| ADHESIVE EPOXIDE COMPOSITION | 2001 | 
 | RU2188840C1 | 
| COLD-CURED EPOXY COMPOSITION | 2018 | 
 | RU2749379C2 | 
| COLD-CURED EPOXY BINDER | 2018 | 
 | RU2749380C2 | 
| ELECTRICAL EMBEDMENT COMPOUND | 2007 | 
 | RU2343577C1 | 
| EPOXY COMPOSITION | 2007 | 
 | RU2345106C1 | 
| INSULATING COMPOUND | 0 | 
 | SU1756942A1 | 
| PREPREG BASED ON ADHESIVE BINDER OF REDUCED FLAMMABILITY AND FIBERGLASS, CARBON FIBER ON ITS BASIS | 2018 | 
 | RU2676634C1 | 
Authors
Dates
1998-10-27—Published
1995-07-17—Filed