SOLDER FOR SOLDERING ZINC AND ITS ALLOYS Russian patent published in 1999 - IPC

Abstract RU 2138378 C1

FIELD: soldering materials. SUBSTANCE: solder contains, wt %: zinc 8-30, indium 0.6- 1.2, lead 0.8-1.2, bismuth 0.3-0.5, silicon 0.3-0.6, lithium 0.1-0.3, and tin - the balance. Utilization of such solder does not lead to embrittlement of basic metal near the border with soldered seam. EFFECT: enabled joining soldered seam to basic metal without non-soldered places and fissures. 1 tbl

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RU 2 138 378 C1

Authors

Vajnerman A.E.

Chumakova I.V.

Karpov V.V.

Arkhipova L.T.

Sorin V.G.

Aseev M.Ju.

Dates

1999-09-27—Published

1996-08-30—Filed