FIELD: electronic engineering; manufacture of semiconductor devices.
SUBSTANCE: proposed method that can be used for assembling silicon chips within semiconductor device case using lead-free solders for their fixation involves covering of chip surface to be soldered with zinc and its soldering to tin-covered base of case. Additionally applied to zinc film is tin-bismuth coat having bismuth content of 0.4 - 0.9%. Such lead-free soldering method improves tin wettability of chip surface at soldering temperature and reduces area of poor solder penetration.
EFFECT: enhanced corrosion resistance of chip surface and reliability of semiconductor device.
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| Title | Year | Author | Number |
|---|---|---|---|
| METHOD FOR LEAD-FREE CONTACT-REACTION SOLDERING SEMICONDUCTOR CHIPS TO HOUSING | 2008 |
|
RU2379785C1 |
| METHOD FOR SOLDERING SEMICONDUCTOR CHIP TO CASE | 1999 |
|
RU2167469C2 |
| LEAD-FREE METHOD OF CONTACT-REACTION SOLDERING SEMICONDUCTOR CHIP TO HOUSING WITH FORMATION OF Al-Zn EUTECTIC | 2008 |
|
RU2375786C1 |
| METHOD FOR LEAD-FREE RESISTANCE-REACTANCE SOLDERING OF SEMICONDUCTOR CHIP TO PACKAGE | 2006 |
|
RU2313156C1 |
| METHOD FOR INSTALLATION AND OF LARGE SEMICONDUCTOR CHIPS IN PACKAGES | 2001 |
|
RU2212730C2 |
| LEAD-FREE SOLDER | 2007 |
|
RU2367551C2 |
| METHOD OF MANUFACTURING METAL-POLYMER HOUSING OF MICROCIRCUIT | 2023 |
|
RU2821166C1 |
| FLUX FOR SOLDERING AND TINNING ALUMINIUM AND ITS ALLOYS | 0 |
|
SU959964A1 |
| METHOD FOR MANUFACTURING THERMOELECTRIC MODULES | 2001 |
|
RU2195049C1 |
| SOLDER FOR SOLDERING ZINC AND ITS ALLOYS | 1996 |
|
RU2138378C1 |
