METHOD FOR OBTAINING ELECTROLYTIC COPPER FOIL Russian patent published in 2021 - IPC C25D1/04 

FIELD: electroforming.

SUBSTANCE: invention relates to the field of electroforming. The method involves the formation of a foil with a thickness of 7 to 10 microns by performing the following steps: an electrolyte containing an aqueous solution of sulfuric acid and copper sulfate is obtained, to which five additives (A)-(E) are added, the electrolyte is placed between an anode comprising a base coated with at least one of the platinum group metals and/or its oxide, and a drum cathode, and direct current is passed, while the ratio (D)/(A) is from 0.2 to 0.7; additive (A): soluble or dispersible nonionic organic compound with a molecular weight of 200,000 to 500,000 in an amount of 5 to 15 parts per million; additive (B): collagen peptide with a molecular weight of 7000 or less in an amount of 6.5 to 15 parts per million; additive (C): sulfonate salt of an active organic sulfur compound in an amount of 2 to 10 parts per million; additive (D): thiourea-based compound in an amount of 2.5 to 15 parts per million; and additive (E): chlorine ion in the amount of 5 to 30 parts per million.

EFFECT: invention makes it possible to obtain thin foil from 7 to 10 microns having electrical conductivity of 99% or more, without the probability of “bending (twisting)”, having roughness of 2.5 microns or less on the front and back sides, and the tensile strength of the foil is 500 MPa or more, and the percentage elongation is 5.5% or more.

7 cl, 1 dwg, 2 tbl, 8 ex