FIELD: manufacture of laminate foils, namely for producing printed circuit boards in electronic and electrical engineering industry branches.
SUBSTANCE: laminate foil includes metallic carrier foil; first barrier layer arranged on one side of metallic carrier foil; second metallic layer arranged on first barrier layer; ultra-fine metallic foil plated onto said metallic layer. Second metallic layer contains combination of metal such as zinc, copper and(or) cobalt and at least one metal such as arsenic, manganese, tin, vanadium, molybdenum, tungsten and (or) antimony. Method for producing laminate foil comprises steps of preparing metallic carrier-foil; depositing first barrier layer, plating second metallic layer onto first barrier layer in bath containing combination of above mentioned metals; plating ultra-fine metallic foil.
EFFECT: production of exfoliated laminate foil that may be used in electronic and electrical engineering industry branches.
34 cl, 3 tbl, 4 ex
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Authors
Dates
2006-11-20—Published
2002-07-10—Filed