FIELD: electronic equipment.
SUBSTANCE: method of manufacturing a hybrid integrated circuit in the microwave range according to the invention involves making a printed circuit board from dielectric layers with through holes, production of a given topological pattern of conductors of a metal coating on the front side of the dielectric layers and screen earthing metallization on the back sides of the lower and upper dielectric layers, combination of dielectric layers with pins and their subsequent gluing into a monolith, securing the multilayer board with the back side at the bottom of the metal housing, securing on the front side of the printed circuit board of the hinged components, including the generator component, formation of a component based on a coaxial dielectric resonator, arrangement of conductors for connection of output of coaxial conductor of resonator to generator and control components, at that, the control component is installed and fixed on the screen earthing metallization of the side of the coaxial dielectric resonator at a distance equal to or greater than the thickness of the multilayer printed circuit board from the lower edge of the resonator, first output of the control component to be grounded is electrically connected to the screen grounding of the surface of the resonator, and its second output is connected to the conductor of metallization on the end side of the coaxial resonator, placing the coaxial dielectric resonator in the through hole of the multilayer printed circuit board, connecting it with the screen earthing metallization to the bottom of the metal housing, upper end of connecting conductor is electrically connected to conductor of topological pattern of metallization of upper layer of printed circuit board, second output of the control component is connected to the conductor of the upper topological layer of the printed circuit board, forming the microwave part of the generator, a set of coaxial dielectric resonator, generator and control components and their electrical connection, hybrid integrated circuit is inspected and the housing is sealed by connecting the cover.
EFFECT: invention provides improved electrical and weight and size characteristics of the hybrid integrated circuit, and reduced labour intensity of its manufacturing.
1 cl, 3 dwg
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Authors
Dates
2025-03-25—Published
2024-11-07—Filed