FIELD: piezoelectric engineering; high-frequency crystal resonators and monolithic filters. SUBSTANCE: process includes pre-grinding of chips by grinding powder as well as intermediate and final double-ended grinding by micropowders while gradually reducing grain size of abrasive material; novelty is that pre-grinding is made on one side only and prior to final double-ended grinding with micropowder chip is subjected to deep chemical etching. EFFECT: improved capacity of process.
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