FIELD: building materials industry, composite materials, more specifically diamond- containing composite materials in structures for various purpose where combination of high modulus of elasticity, heat conduction, low density and other physico-mechanical properties is required. SUBSTANCE: invention makes it possible to prepare material composed of 20-60 wt % of diamond crystals located in matrix comprising 3-7 wt % of silicon carbide and 1-40 vol % of silicon having high physico-mechanical and heat physical properties. Said material is cheaper than well known materials and is more technologically effective. Material has elasticity modulus E=500-700 GPa, heat conduction coefficient λ=180-250 W/mK, specific rigidity H=15-20•106 m, density d=3200-3400 kg/cubic m. EFFECT: improved properties of the constructional material. 1 tbl
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Authors
Dates
2000-06-20—Published
1997-09-05—Filed