FIELD: microelectronics. SUBSTANCE: carrying member meant for installation in card with built-in microprocessor unit and for soldering on printed circuits has copper coating on plastic film whose structure is formed by etching so that contact surfaces are built integral with conductors terminated on edges of carrying member ensuring reliable soldering. Proposed carrying member can be mounted both in compliance with ISO standards in cards with built-in microprocessor units and on surface. EFFECT: enlarged functional capabilities. 12 cl, 7 dwg
Authors
Dates
2000-09-20—Published
1997-05-14—Filed