FIELD: microelectronics. SUBSTANCE: module of first alternative has backing-mounted integrating circuit inside stiffening frame installed on socket-like pedestal of backing that functions as supporting frame around integrating circuit and conducting structures in the form of printed conductors. Frame support is made of same material as printed conductors and where they are passed under stiffening frame mentioned conductors form part of supporting frame. Frame support has breaks provided between parts of socle-like pedestal and formed by printed conductors and parts of socket-like pedestal which are not formed by printed conductors; mentioned breaks are filled with adhesive for sticking stiffening frame to socle-like pedestal. Module of second alternative has its printed conductors disposed where they reach pedestal and they function themselves as socle-like pedestal. Proposed modules can be installed precisely in desired position independent of other structures of contactless card. EFFECT: simplified design, enhanced reliability due to excluding any short circuits in conducting structures. 4 cl, 3 dwg
