FIELD: modules of cards using integrated circuits. SUBSTANCE: module has printed- circuit conductors and integrated-circuit medium, one or more semiconductor integrated circuits, and, if necessary, stiffness member frame. One or more semiconductor integrated circuits and/or stiffness member frame are secured by means of nonconducting adhesive including nonconducting particles of definite size used as gaskets. Adhesive recommended for the purpose is elastic adhesive material and recommended particles are those made of damping material. Semiconductor integrated circuits and/or stiffness member frame are stuck to substrate so that they are spaced at constant distance from the latter. Elastic adhesive and damping particles are consistent with integrated-circuit module strains and prevent damage to adjacent stuck surfaces. EFFECT: reduced damage probability, facilitated auxiliary procedures such as soldering of wire leads, enhanced reliability of cards. 18 cl, 4 dwg
