FIELD: electronic engineering; current-conducting films for resistive film heaters. SUBSTANCE: compound has in its composition 0.5-22.0 mole percent of alkali metal salts of weak oxygen-containing acid ((Na2SiO3, K2SiO3, Na2Cr2O7, and the like) or their mixture and 78.0-99.5 mole percent of aluminum powder. Mixture of aluminum powders and salt (salts) applied to silica-containing ceramic or glassceramic substrate is subjected to high-temperature annealing to form solid current-conducting film layer. EFFECT: improved physical and mechanical properties of film for wide channels of silica substrates. 1 tbl
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Authors
Dates
2001-06-20—Published
1997-04-15—Filed