MULTILAYER CERAMIC SUBSTRATE MANUFACTURING PROCESS Russian patent published in 2002 - IPC

FIELD: manufacture of multilayer ceramic substrates including those obtained by low-temperature burning. SUBSTANCE: conductors and/or metallized holes for interlayer connections are printed on several damp ceramic films using current-conducting paste, then damp ceramic films are stacked one onto other and burned. Current-conducting paste used for manufacturing printed conductors and making metallized holes incorporates wax and is free from volatile solvents which makes it possible to dispense with drying damp ceramic films thereby reducing production period. Films may be stacked and burned immediately after printing conductors and making metallized holes. Shrinkage of printed conductors and damp ceramic films prior to burning is eliminated thereby preventing distortions of precision structures of printed conductors and damp films. EFFECT: enhanced precision of substrate manufacture. 2 cl