METALLISATION METHOD OF CERAMICS USING METAL-COATED TAPE Russian patent published in 2020 - IPC C04B41/88 C04B37/02 

FIELD: metallurgy.

SUBSTANCE: invention relates to production of metal coatings on the surface of various dielectric and semiconductor materials of flat shape in form of plates (substrates) and can be used to create multilayer materials such as metal-ceramics for electronic, electrical and radio engineering industry in production of metallized substrates of power modules, heat-removing elements of high-power transistors and housings for super-bright LEDs. Method of metallisation of ceramics involves application on ceramic substrate from above and from below of adhesive layer and copper layer. Metallization layers are applied by heat transfer by means of tape made of polymer material with multilayer metal coating applied on it and formed by required topological pattern produced by laser cutting. Injection of metal coating with formed pattern is performed in hydrogen medium in one cycle. Multilayer metallisation coating with the formed topological pattern on the substrate is formed from conducting, resistive and dielectric layers for simultaneous production of various drawing elements.

EFFECT: method enables to obtain a dense strong coating with a controlled thickness and a topological pattern, is cheap and high-performance.

3 cl