METHOD FOR MANUFACTURING THERMOELECTRIC MODULES Russian patent published in 2002 - IPC

FIELD: thermoelectric instrumentation engineering. SUBSTANCE: method for manufacturing thermoelectric modules of Peltier- or Seebeck-effect thermoelectric devices, primarily refrigerating ones, and also thermoelectric power generators includes covering nickel or cobalt-coated effective ends of semiconductor thermoelectric material arms with solder, soldering of rows of arms to form thermocouples or row of thermocouples, and soldering thermocouples or thermocouple rows to form thermoelectric modules using same solder; multicomponent solder used at maximal working temperature of module hot junction up to 120 C has following proportion of ingredients, mass percent: tin, 10 to 52; indium, 15 to 48; cadmium, 0 to 10; antimony, 0 to 10; lead, the rest; multicomponent solder used at working temperature of module hot junction up to 290 C is composed of following ingredients, mass percent: tin, 1.2 to 5.0; silver, 1.5 to 6.0; lead, the rest; soldering is made for 5 to 10 s at temperature exceeding that of solder liquids by 20 to 30 C. EFFECT: enhanced quality of manufacture of thermocouples and their arms thereby improving performance characteristics of modules. 4 dwg