FIELD: semiconductor engineering; nonlinear semiconductor resistors with negative temperature coefficient of resistance. SUBSTANCE: method includes fixation of metal leads on opposite sides of chip, their cross-sectional area being larger than butt- end areas of chip; encapsulation in case made in the form of glass tube whose inner diameter is equal to diameter of metal leads. Process is conducted in a single step during encapsulation in case where current pulses of 0.05-3.0 A in amplitude and 8-20 milliseconds in length are supplied through chip and metal leads as metal leads are being wetted with glass, at the same time disconnecting external heat source. In the process resistor rating is controlled. EFFECT: enhanced reliability of lead-to-chip contact; facilitated manufacture. 2 dwg
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Authors
Dates
2003-01-20—Published
2001-10-24—Filed