METHOD FOR CUTTING OF MONOCRYSTALS AND OTHER BRITTLE MATERIALS Russian patent published in 2001 - IPC

FIELD: mechanical treatment of solid brittle materials, in particular; methods for mechanical cutting of monocrystals into plates. SUBSTANCE: monocrystal is secured on a supporting structure, steel bands are fed installed on the machine frame and being in reciprocating motion, abrasive suspension is fed to the cutting zone, bars, whose axis is perpendicular to the direction of motion of the saw blades, and their height is larger than the height of the monocrystal to be cut, are installed on both sides of the monocrystal to be cut in the direction of motion of the saw blades. Use is made of bars of the rectangular or trapezoidal shape, where one lateral side facing the monocrystal to be cut is perpendicular to the bases, and the other is deflected from the first one by an angle of 5 to 10 deg, the bars are fastened to the supporting structure with the lesser base. EFFECT: enhanced accuracy of orientation of the plates to be cut relative to the crystallographic axes, improved planeness with the aim of production of highly qualitative semi-finished products of the supporting structures for acoustoelectronics, optics and semiconductor equipment. 5 cl, 2 dwg, 2 ex