FIELD: semiconductor engineering. SUBSTANCE: device has metal case that functions as one of its electrodes, lead that serves as second electrode of device, semiconductor rectifying circuit, insulator designed to electrically insulate lead from case, alignment ring, and disk springs. Metal case of device is made of one-piece material in the form of hollow cylinder incorporating lower part whose bottom mounts rectifying circuit and alignment ring and upper part designed for accommodating disk springs, its outer and inner diameters being greater than respective diameters of lower part. Edge provided near open end of case is used to transmit mechanical stresses. It is formed due to narrowing upper-part walls deformed for holding disk springs in compressed state with space formed above them for sealing material, its diameter reducing towards open end of case. Flexible sealing dusk is placed between lower and upper parts of device case under disk springs and flexible sealing ring is fitted onto device lead under insulator. Proposed device may be designed with both two and three electrodes and lower part of case has small dimensions which do not depend on size of disk springs and number of electrodes. Device is designed so that ingress of sealing material into hold-down contact zone and its removal from case is made impossible. EFFECT: improved design of device. 3 cl, 3 dwg
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Authors
Dates
2003-03-20—Published
2000-12-14—Filed