ARRANGEMENT OF SEMICONDUCTOR DEVICE Russian patent published in 2004 - IPC

FIELD: high-power semiconductor equipment.

SUBSTANCE: technical objective of invention lies in provision for mutual fixing of case and base of device along its vertical axis and in prevention of loss of sealing by device in case of sudden temperature variations. Structure of semiconductor device comprises metal base showing upper zone with pedestal and lock embracing pedestal and lower zone intended for attachment of semiconductor device in cooler, case made of dielectric material mounted on upper zone of base, semiconductor rectifying element put on pedestal, lead-out anchored on semiconductor rectifying element that is one electrode of device, sealing compound which fills up space of case. Butt of case bordering on base has internal edge enclosing lock. Platform on which internal edge of case rests is made in upper zone of base around lock. Space in base located between pedestal and lock and inner space of case are filled up with sealing dielectric material above lock and internal edge of case. Outer diameter of lower zone of base is smaller than outer diameter of upper zone of base. Sides for wrench are cut in upper zone of base, thread is cut in lower zone of base. Base includes metal cylinder and insert anchored in it.

EFFECT: mutual fixing of case and base of semiconductor device.

4 cl, 5 dwg