FIELD: semiconductor devices. SUBSTANCE: method for organizing air gaps in semiconductor structures involves filling of closed inner space of structure with material being removed, decomposition of material being removed into gaseous decay products, and their removal by diffusion through solid layer abutting against inner space. EFFECT: reduced capacitive coupling in semiconductor structures between electrical components. 40 cl, 34 dwg
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Authors
Dates
2003-05-10—Published
1998-01-21—Filed