HEAT SINK Russian patent published in 2003 - IPC

FIELD: cooling semiconductor devices for electrical and radio engineering. SUBSTANCE: heat sink is produced by extrusion method and has base with press-fitted ribs fluted on their outer surface. Through slots are made in heat sink base over its entire surface under each rib and depressions are provided at base of heat-sink ribs throughout entire length so that shaped through holes will be obtained after molding under each rib to ensure more effective natural and especially forced cooling. EFFECT: enlarged heat-transfer surface area and reduced mass of heat sink. 1 cl, 4 dwg