FIELD: measurement technology. SUBSTANCE: method intended for producing small-size micromechanical sensors such as accelerometers, gyroscopes, and the like involves introduction of improvements in controlling silicon etching process when shaping rectangular-section jumpers and provides for facilitated assembly of sensor concurrently with its sealing in the course of its assembly and in service. EFFECT: enhanced sensitivity and facilitated assembly and sealing of device. 3 cl, 7 dwg
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