FIELD: instrument engineering.
SUBSTANCE: invention relates to instrument-making and can be used in the manufacture of elastic elements used in the construction of silicon sensitive elements of micromechanical sensors – accelerometers, gyroscopes, angular velocity sensors. In the method for manufacturing elastic elements from monocrystalline silicon, a flat circular plate is oxidized with the orientation of the base surface in plane (100), put on it a protective layer of photoresist, conduct photolithography, open windows in the oxide layer in the region of the formation of elastic elements by a certain width, taking into account the anisotropy of etching of monocrystalline silicon, anisotropically etched to the depth to obtain the required thickness of the elastic elements, isotropically etched with the simultaneous formation of galvanic transitions. In this method, after the anisotropic etching, the oxide layer is removed, a protective film is applied, by photolithography a pattern is formed for isotropic etching, after which isotropically etched silicon and the protective film is removed.
EFFECT: technical result of the invention is the obtaining of elastic elements of the required thickness on silicon wafers by anisotropic etching with the elimination of concentrators of mechanical stresses at all internal and external angles of the formed silicon structures by isotropic etching with additional protection of the plate surface.
1 cl, 5 dwg
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Authors
Dates
2018-03-23—Published
2016-12-27—Filed