FIELD: manufacture of semiconductor devices. SUBSTANCE: method for producing flexible components of integrated measuring transducers from single-crystalline silicon includes anisotropic etching of single-crystalline silicon wafer followed by anisotropic additional etching. Anisotropic etching is conducted at the same time extracting wafer from solution. EFFECT: enhanced reproducibility of flexible component dimensions due to source wafer wedging correction. 1 cl, 2 dwg
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