FIELD: testing equipment, group testing of strength of microjoints of semiconductor articles. SUBSTANCE: plant to test strength of microjoints of semiconductor articles has mechanism of application of peeling load coming in the form of vacuum head comprising vacuum chamber and system of vacuum compartments placed opposite to each microjoint and having calibrated holes and throttling grooves in walls matched to proper microjoints and walls of vacuum chamber. In this case holes in vacuum compartments are made in the form of continuous grooves arranged over perimeter of crystal and package above formed microjoints. EFFECT: simplified design of plant, enhanced quality of test of strength of microjoints and possibility of cleaning space under package of semiconductor device and integrated circuits from dust and other foreign particles. 3 dwg
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Authors
Dates
2002-07-27—Published
2000-02-18—Filed