FIELD: memory and data processing devices.
SUBSTANCE: proposed device has at least two deck-forming layers (L) disposed on substrate or forming separate structure of sandwich type wherein mentioned layers form memory and/or data processing circuits with interlayer or circuit-to-circuit connections formed in substrate; layers are relatively positioned so that longer ones form shifted structure at least along device edge. At least one end connector is provided that protrudes from edge of one layer and runs one step downward. In this way electrical connection is provided with conductor in any of next layers of deck. Proposed method for manufacturing this device involves operations for sequential addition of such layers to form shifted structure. In the process one or more layers are provided by at least one contact pad for connection to one or more interlayer end connection. Electrical connections produced by this method have deck incorporating two or more functional parts in the form of sheets or films partially or fully overlapping each other.
EFFECT: reduced manufacturing cost due to use of mass-production technologies.
14 cl, 11 dwg
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Authors
Dates
2004-10-10—Published
2001-03-15—Filed