METHOD FOR SOLDERING HONEYCOMB PANELS Russian patent published in 2004 - IPC

Abstract RU 2242341 C1

FIELD: manufacture of complex-profile panels with variable cross section, for example hollow vanes of fan of aircraft engine.

SUBSTANCE: honeycomb panels includes boards between which honeycomb fillers are arranged. Method comprises steps of placing solder in soldering zone; assembling soldered panels at forcing boards one to other; heating them until soldering temperature and cooling. Boards are forced one to other by means of fitting at predetermined temperature condition of plastic deformation lower than solder melting temperature by 50 -250 C. At least two parts of fitting are used for forcing boards. Cooling is realized at minimally admissible temperature gradient along length of panel at heating portion of panel of less cross section. Method allows to prevent undesirable deformations of thin-wall panels, non-soldered spots and non-uniform soldered joint.

EFFECT: enhanced quality of soldered panels.

3 cl, 1 dwg, 1 tbl

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RU 2 242 341 C1

Authors

Urzhuntsev M.A.

Karasev V.M.

Kostenko I.F.

Lipatov A.S.

Lashkov V.I.

Dates

2004-12-20Published

2003-07-08Filed