FIELD: computer-laser breadboarding.
SUBSTANCE: using a system for three-dimensional geometric modeling, volumetric model of product is made, separated on thin transverse layers and hard model is synthesized layer-wise, thickness A of transverse layers is picked from condition, where A≤F, where F is an allowed value for nominal profile of model surface and generatrix of model surface profile passes through middle line of transverse layers.
EFFECT: shorter time needed for manufacture of solid model.
1 dwg
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