METHOD FOR MANUFACTURING RELIEF ELECTRONIC BOARD Russian patent published in 2006 - IPC H05K3/00 

FIELD: technology for manufacturing radio-electronic equipment, possible use for manufacturing relief electronic boards.

SUBSTANCE: method for manufacturing relief electronic board includes forming components of electric circuit on dielectric base by metallization of previously formed mechanical relief contours of electric circuit on dielectric base, applying a layer of copper, applying a screening layer of painting substance above copper layer for masking portions not subject for removal, removal of base metal outside contours of electric circuit, applying finishing layer of cover substance on basis of tin-lead alloy by galvanic method, prior to metallization of dielectric base of electronic board it is saturated with organic complex material after mechanical processing, metallization of discontinuous base is performed by stage-wise metallization firstly by copper layer to minimal thickness not less than 25-30 micrometers, metallization of dielectric base is performed prior to applying a layer of painting substance outside contour of mechanical relief, selective applying of finishing layer on basis of tin-lead allot is performed by galvanic method selectively only onto portions of mechanical contour, after that screening layer of painting substance is removed, copper layer outside mechanical relief is removed as well, and tin-lead galvanic layer is finally burned off in accordance to infrared method.

EFFECT: improved metallization quality due to decreased "edge effect" during galvanic copper coating, improved precision of reproduction of electric-conductive relief contour of electric circuit during metallization, improved moisture resistance of products and possible burn-off of main layer of galvanic cover by tin-lead alloy.

1 dwg, 1 tbl, 1 ex