METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARD Russian patent published in 2008 - IPC H05K3/06 H05K3/18 

FIELD: various branches of microelectronics and manufacture of printed circuit boards, in particular, manufacture of multilayer printed circuit boards.

SUBSTANCE: a current-conducting pattern of the electric circuit is formed on the dielectric base in succession by the method of photolithography with production of a layer of metalloresist, the dielectric base is punched and through holes are obtained on the preset sections, and a metal-containing coating is applied by the galvanic method. After that the layer of the current-conducting coating is protected, and the coating is removed from the non-sanctioned sections corresponding to the photolithographic circuit by the method of chemical pickling. Finally the lands are fused. Solutions of cuprous chloride are used as the pickling agent for chemical pickling, and a tin-bismuth alloy obtained from electrolyte based on the salts of thin and bismuth is used as an unremoved layer of metalloresist with a brightener by galvanic method at a current density of 1 to 6 A/sq.dm. EKOMET-L 6 is used as the brightener.

EFFECT: developed method for manufacture of the printed circuit board characterized by a high accuracy of reproduction of the electric circuit pattern providing a high adhesion of the layer of metalloresist to the substrate, lands and to the walls of the punched holes of the printed circuit board preserving the ability of soldering by a tin-containing alloy during a long period of time (about 6 months).

2 cl, 2 ex, 1 tbl