FIELD: metallurgy; method and the device of the electron-beam evaporation and deposition of materials.
SUBSTANCE: the invention is pertaining to the field of metallurgy, in particular, to an method and the device of the electron-beam evaporation and deposition of materials. The process of evaporation and the process of deposition are conducted in the two separate chambers linked to each other through a hole. The various pressure is maintained in the chambers. The annular supersonic stream of the gas is formed around of the hole maintaining the pressure difference between the chambers and allowing the vapor flow to pass through the hole from one chamber into another. The process of evaporation is conducted at the pressure from 10-4 up to 10-1 Pa. The deposition is conducted in the range of the pressure from 10-1 Pa up to the atmospheric pressure. The deposition is realized from the gas stream, which has caught the vapor passed through the hole, intermixed its components and focalized them. The invention also offers the device for realization of the method. The technical result of the invention consists: in the raised factor of the material usage and production of the chemically homogeneous composition of the condensates at evaporation from the several sources containing the various materials and without reduction of the power efficiency output of the process and without complication of the equipment; in the possibility to apply the electron-beam coatings on the inner surfaces of the articles, and also to conduct the coatings deposition at the low vacuum conditions on the Ni-, Co-, Ti-bases containing up to 20 % of W, Mo, Re and other refractory metal.
EFFECT: the invention ensures the raised factor of the material usage, production of the chemically homogeneous composition of the condensates at evaporation from the several sources of various materials without reduction of the power efficiency of the process and complication of the equipment; application of the electron-beam coatings on the inner surfaces of the articles; coatings deposition at the low vacuum conditions on the Ni-, Co-, Ti-bases containing up to 20 % of W, Mo, Re and other refractory metal.
25 cl, 8 dwg, 2 ex
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Authors
Dates
2006-05-27—Published
2005-01-18—Filed