SOLDER MAKING METHOD Russian patent published in 2007 - IPC B23K35/40 B23K35/26 C22C13/00 

FIELD: processes for soldering parts of electronic and radio equipment.

SUBSTANCE: prepared solder contains next relation of components, mass%: silver, 1.5 - 3.5; copper, 0.4 - 1.0; germanium, 0.1 - 0.2; tin, the balance. Method for making solder comprises steps of mixing silver, copper and tin in quantity selected according to condition for preparing solder of given composition; pouring prepared solid components mixture in crucible; adding in crucible liquid slag on base of organic compounds; melting prepared mixture and heating melt till temperature 600 - 800°C; then adding to melt designed quantity of germanium and flux on base of salt systems; keeping melt at such temperature for 5 - 10 min while agitating it; cooling solder at rate no less than 10°C/s. Invention provides enhanced strength of soldered joint and of solder itself as germanium is fixed (at process for preparing solder) in the form of uniformly dispersed finely divided fraction.

EFFECT: improved strength of solder and soldered joint.

1 ex