FIELD: vacuum deposition of metal and dielectric coatings.
SUBSTANCE: device can be used for making items having coatings made of metals, glass, polymer films and fabrics. Anode of device has gas distribution system, which provides uniform supply of working gas along total surface of cathode to be sputtered; anode is under positive potential. Cathode has cooling system and cathode-target to be sputtered, which target-cathode is disposed between poles of magnetic system. Magnetic system has set of magnets with pole tips disposed onto water-cooled magnetic circuit made of soft magnetic steel. Set of magnets is under floating potential. Factor of usage of target material is equal to 60-70%.
EFFECT: high uniformity of coating; minimized thermal load onto substrates.
4 cl, 3 dwg
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