METHOD OF ASSEMBLING ELECTRONIC MODULES Russian patent published in 2024 - IPC H05K13/04 

FIELD: electronic industry.

SUBSTANCE: invention relates to electronic industry and can be used in production of electronic modules with high density of mounting on printed circuit board. Method of assembling electronic modules involves applying a layer of solder paste on the contact pads of a printed circuit board through a stencil, followed by automatic installation of SMD components on this paste in places intended for them. Then the board is placed into the furnace for soldering. After the SMD components are installed on the printed circuit board, a correction board of the same size with a layer of the applied magnetic paste is brought under it along the areas corresponding to the arrangement of the SMD components on the printed circuit board in need of position correction, at a distance which provides magnetic interaction of the constant magnetic field of the areas covered with the magnetic paste and the metal contacts of the mounted SMD components. This aligns their position on the printed circuit board. After alignment, the correction board is removed.

EFFECT: improving the quality of solder connections during the installation of small-sized electronic SMD components on a printed circuit board.

2 cl, 4 dwg