FIELD: light-emitting electronic engineering; modular structures of high-power semiconductor light sources that can be used as separate light sources or as parts of lighting system.
SUBSTANCE: proposed light-emitting semiconductor module has solid base made of heat-conducting material in the form of disk with vertically positioned projection in center. Light-emitting semiconductor component is disposed on substrate above base projection. Contact member affording connection of light-emitting component contacts to external electrical conductors is made in the form of insulating plate whose top and bottom surfaces are covered with metal and insulation. Through hole provided in plate center is shaped to follow shape of external side surface of base projection; plate is disposed on top of base so that base projection passes through plate hole. Upper surface of plate has metal-plated sections near central hole which are used to provide electric coupling between contacts of light-emitting component and metal layer of plate. Disposed on end sections of plate, on its top and bottom surfaces, are metal-plated sections designed for connecting external electrical conductors to plate.
EFFECT: enhanced mechanical strength of module, enlarged capabilities of mounting the latter on board thereby enabling use of module in lighting fixtures of various design alternates.
4 cl, 1 dwg
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Authors
Dates
2008-03-27—Published
2006-12-21—Filed