LED CHIP Russian patent published in 2018 - IPC H01L33/36 

FIELD: lighting.

SUBSTANCE: LED chip includes a semiconductor light-emitting element mounted on a substrate comprising of a plate made of a dielectric and also a polymer-compound coating placed over the said light-emitting element and the plate, with the first and second metallization zones are formed on the edge portions of the upper surface of the dielectric plate near its lateral sides, and the light-emitting element has a positive and negative metallic electrical terminals, one of which is connected to the first metallization zone, and the other is connected to the second metallization zone. The base is made in the form of a mono-plate made of a dielectric, with the said plate comprising of the third metallization zone formed in the central part of its upper surface, the area of which exceeds the area of the lower surface of the light-emitting element, and also contains the fourth, fifth and sixth metallization zones formed on its lower surface and similar in configuration and location to the first, second and third metallization zones, respectively. The light-emitting element is located on the surface of the third metallization zone. In the dielectric plate, side metallized openings are provided through which the first and fourth metallization zones and the second and fifth metallization zones are communicated with each other as well as the central metallized through holes, located on the side of the upper surface of the said plate in areas not occupied by the light-emitting element by means of which the third and sixth zones of metallization are communicated with each other.

EFFECT: simplification of the design and manufacturing technology of the LED chip while providing high heat dissipating properties.

3 cl, 2 dwg