FIELD: semiconductor optoelectronics; solid-state light sources. SUBSTANCE: device has fluorescent semiconductor chips with p-n junctions placed in N depressions of base and relevant contacts on their both sides; base is made of silicon strip covered with insulating layer carrying isolated bonding sections that cover depressions and adjacent sections of base; upper contact of each i-th chip is connected through wire electrode to bonding section of i-th depression and upper contact of i-th chip, to bonding area above base surface. EFFECT: improved power, reduced size, facilitated manufacture. 1 cl, 2 dwg
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Authors
Dates
1999-11-27—Published
1997-06-10—Filed