FIELD: chemistry.
SUBSTANCE: method of making flexible micro-printed circuit board includes pre-oxidising a monocrystalline silicon plate with thickness of 20-100 mcm, diameter of 200-300 mcm and orientation <100>; applying a coating; performing photolithography; coating the obtained electronic circuit with a polymer layer; dissolving the silicon dioxide film and peeling the silicon plate to form a flexible micro-printed circuit board on the polymer film.
EFFECT: obtaining highly dense packaging with the width of electroconductive tracks of less than 50 mcm and a shorter process cycle.
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