METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURE Russian patent published in 2008 - IPC H05K3/06 H05K3/22 

FIELD: radio engineering.

SUBSTANCE: method of printed circuit board manufacture provides for consecutive application of aluminium layer, metal resistant nickel (cobalt) layer onto metal plate and production of electroconductive copper circuit by formation of protection relief made of photo sensitive resist on nickel and cobalt resist coating and copper application onto sections unprotected by photo resist. Fabricated electroconductive copper circuit is coated with thin polymer layer. Polymer film is then separated by aluminium layer dissolving and protective pattern is formed out of nickel or cobalt coating on electroconductive copper circuit. In order to manufacture two-sided flexible boards after film photo sensitive resist layer removal, two boards are joined with polymer layer from the side of electroconductive circuit and aluminium layers are then dissolved. Metal plates are separated. Protective pattern of electroconductive circuit is generated on nickel or cobalt coating by photolithography and two-sided flexible board is produced.

EFFECT: production of electroconductive printed circuit boards on polymer basis with well-soldered electrical circuit stable to oxidation at 100 mcm wide electroconductive tracks.

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