FIELD: radio electronics.
SUBSTANCE: aluminum coating is applied onto metal plate by means of thermal decay; thickness of the coating is 20-25 mcm. Then metal-resistive nickel or cobalt coating with thickness of 4-5 mcm is applied onto the same plate as well as electro-conductive copper or molybdenum coating with thickness of 20-30 mcm. After that by method of photolithography the pattern of board is made and it is subsequently covered with thin layer of polymer with thickness of 80-100 mcm. Then molybdenum film with electro-conductive circuit and metal-resistive coating is removed by solving aluminum layer. To make two-sided flexible printed circuit boards, after pattern of electro-conductive circuit is made by method of photolithography, two board are connected together by polymer layer at the side of electro-conductive circuit and then aluminum layers are dissolved and metal plates are removed.
EFFECT: improved reliability; simplification; reduced cost.
2 cl
| Title | Year | Author | Number | 
|---|---|---|---|
| METHOD FOR MAKING FLEXIBLE MULTI-LAYER ELECTRONIC BOARDS | 2005 | 
 | RU2291598C2 | 
| METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURE | 2007 | 
 | RU2329621C1 | 
| METHOD OF MANUFACTURING FLEXIBLE MICROPRINTED BOARD | 2012 | 
 | RU2520568C1 | 
| METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS | 2003 | 
 | RU2246558C1 | 
| METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARDS | 2007 | 
 | RU2328839C1 | 
| METHOD OF MAKING PRINTED CIRCUIT BOARDS | 2008 | 
 | RU2382532C1 | 
| METHOD FOR MANUFACTURING ELECTRONIC BOARDS | 2004 | 
 | RU2282319C2 | 
| MANUFACTURING METHOD OF RELIEF PRINTED-CIRCUIT BOARDS | 2010 | 
 | RU2416894C1 | 
| METHOD OF MAKING FLEXIBLE MICRO-PRINTED CIRCUIT BOARDS | 2014 | 
 | RU2556697C1 | 
| PRINTED-CIRCUIT BOARD MANUFACTURING PROCESS | 2002 | 
 | RU2231939C1 | 
Authors
Dates
2006-06-10—Published
2004-11-15—Filed