METHOD FOR MAKING FLEXIBLE MULTI-LAYER ELECTRONIC BOARDS Russian patent published in 2007 - IPC H05K3/46 B32B15/04 C22C21/12 

FIELD: radio-electronics, possible use for manufacturing multi-layer electronic boards used during engineering of radio-electronic equipment.

SUBSTANCE: method includes serially applying layers onto substrate, one of which layers is electro-conductive. As substrate, aluminum foil is used 50 micrometer thick, onto which firstly metal-resistive nickel or cobalt layer is applied 3-5 micrometers thick, then - electro-conductive copper or molybdenum layer 8-10 micrometers thick. Then by means of photo-lithography a pattern of electro-conductive circuit is produced, covered by dielectric oxide-chromic black-colored layer 5-8 micrometers thick. A layer of polymer 50-100 micrometers thick is applied and aluminum foil is dissolved. A variant of aforementioned method is a method, which includes using two substrates made of aluminum foil 50 micrometers thick, onto each of which firstly metal-resistive nickel or cobalt layer is applied. Then - electro-conductive copper or molybdenum layer. By means of photo-lithography pattern of electro-conductive circuit is produced, two substrates with multi-layer polymer cover are connected to one another on the side of electro-conductive circuit. Aluminum foil is dissolved and two-sided board is produced.

EFFECT: production of flexible multi-layer electronic boards on polymeric base with electro-conductive circuit well fit for soldering and resistant to oxidizing.

2 cl, 3 ex