EPOXY COMPOUND SOLIDIFICATION METHOD Russian patent published in 2008 - IPC B29C35/08 C09K3/10 

FIELD: instrument making.

SUBSTANCE: invention relates to processing of plastic materials, in particular, to processing polymer materials and is designed to produce sealing coatings used in production of no-case semiconductor components. The invention aims at optimising the solidification conditions of sealing epoxy compounds. With this aim in view, the proposed method of epoxy compound solidification incorporating a thermal treatment of the above compounds, unlike known techniques, is effected step-by-step in compliance with a linear dependence of the logarithm of concentration of the compound epoxy active reactants upon the thermal treatment time logarithm till disappearance of the said compound epoxy groups. Here the concentration of the latter is defined by the differential scan calorimetry (DSC) in the function of solidification heat, or by the IR-Fourier spectroscopy (IRS) in the function of a magnitude proportional to solidification heat, or, by the IR spectroscopy, in the function of a magnitude proportional to the Gauss approximation peak area in the band of a spectrum of diffuse reflection after the Kubelk-Munk transformation. Epoxy compounds processed by the proposed method feature higher resistance to outer effects an ability to preserve their chemical, physical and thermal-and-physical properties since they incorporate, after treatment, active reactant groups.

EFFECT: optimisation of solidification of sealing epoxy compounds.

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