SEALING COMPOUND Russian patent published in 2008 - IPC C08K3/10 C08L63/02 H01B3/40 H01L23/28 

FIELD: chemistry.

SUBSTANCE: invention pertains to a composition based on an epoxide resin, designed for sealing semiconductor devices. The compound consists of the following components in the given mass ratios: 100 epoxide resin "ЭД-22" with 22% content of epoxide groups for formation of a more compact and tough polymer network, 50 oligoester acrylates "МГФ-9", 20 metaphenylene diamine, 35 filler, 0.5 nigrosine as black dye and a catalyst of the solidification reaction of the epoxy groups. The filler is a mixture of 6.0 mass ratio of boron nitride, 4.0 mass ratio of talc and 0.8 mass ratio of aerosil.

EFFECT: invention provides sealing devices with extended surfaces of p-n-junctions and consistency of dielectric, mechanical and thermophysical properties of polymer material.

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