FIELD: chemistry.
SUBSTANCE: epoxy composition of hot curing includes epoxy diane oligomer of brand ED-20 (100 wt.p.), curing agent of anhydride type (80 wt.p.), and additionally contains derivatives of polysaccharides (1.0-10.0 wt.p.) as modifying additive.
EFFECT: invention makes it possible to increase mechanical strength, elasticity modulus and glass transition temperature of products.
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Authors
Dates
2015-08-20—Published
2014-05-05—Filed