THERMOELECTRIC MODULE WITH IMPROVED HEAT- TRANSFER APPARATUS AND ITS MANUFACTURING PROCESS Russian patent published in 2002 - IPC

FIELD: semiconductor electronics. SUBSTANCE: thermoelectric module manufacturing process may be as follows. Thermoelectric integrated circuit carrying on its upper and lower surfaces open surfaces of n- and p-type semiconductor components is produced by mounting semiconductor components in the form of array so that each n-type semiconductor component is close to p-type component with gap inbetween filled with insulating material in the form of resin of first polarity of conductivity. Metal layer is deposited on each of the open surfaces of semiconductor components mounted on upper and lower surfaces of thermoelectric integrated circuit. Then first electrodes are formed on upper surface of thermoelectric integrated circuit according to first pattern of circuit; each of these electrodes electrically interconnects adjacent semiconductor components. In the same way second electrodes are formed on lower surface of thermoelectric integrated circuit according to second pattern of circuit distinguished from first one; each of these electrodes electrically interconnects adjacent semiconductor components. For producing flexible and structurally steady thermoelectric module insulation sheet of polyamide resin material containing ceramic powder of high thermal conductivity is joined with upper and lower surfaces of thermoelectric integrated circuit. EFFECT: enhanced heat-transfer ability and material fluidity of semiconductor components. 12 cl, 30 dwg