FIELD: technological processes.
SUBSTANCE: tool includes a case and clamping wedge. The case features base surface for cutting plate mounting, and carrier surface for the wedge, protruding upwards. Cutting plate has a through hole and mounting angle. A carrier pin protruding upwards is positioned partially under the carrier surface and partially in the through cutter plate hole. Clamping wedge has a socket for the plate, restricted by two side walls forming an angle for plate installation. Rear carrier surfaces of clamping wedge are interacting with the wedge carrier surface. Cutting plate has four sides and mounting non-obtuse angle, while a normal to the wedge carrier surface passes through the carrier pin center and first side socket wall in side wall couple when the plate is properly fixed. To enable fixation of plates at obtuse and smaller angles at the same case, wedge carrier surface is graded and includes first and second carrier surfaces positioned in stages at α angle to each other. The second wedge carrier surface adjoins base surface, while the first wedge carrier surface adjoins upper surface of clamping part. The tool includes additional clamping wedge for fixation of additional cutting plate with obtuse installation angle. Additional wedge has a socket with two side walls forming a mounting angle for obtuse-angle additional cutting plate mounting. Rear carrier surfaces of additional clamping wedge are intended for contact to the first wedge carrier surface, while a normal line to the first wedge carrier surface passes through the carrier pin centre if viewed from above, and divides mounting angle of additional cutting plate in halves.
EFFECT: improved device application efficiency.
9 cl, 13 dwg
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Authors
Dates
2008-09-27—Published
2003-12-08—Filed