FIELD: food products.
SUBSTANCE: mould includes punch and split die, with clearance between them, and the die has inner side face and bottom. The die has slots made from the inner side face. Total inner side face area of the die together with the slots equals 1.06÷1.5 of the inner side face area of the die without slots, and the slots are minimum 0.6-mm deep. For baking hollow cup-shaped wafer products the total inner side face area of the die together with slots equals 1.28÷1.30 of the inner side face area of the die without slots, for baking hollow cone-shaped wafer products it is 1.30÷1.36, for baking hollow basket-shaped wafer products of a height at least 20 mm and a volume of 80 mm3 the total inner side face area of the die together with slots equals 1.1÷1.12 of the inner side face area of the die without slots. The clearance between the die and punch increases towards the bottom. In particular, the clearance at the die bottom can exceed the clearance at the top by 0.1÷0.3 mm. The mould slot can be vertically or horizontally oriented.
EFFECT: high quality hollow wafer products high concentration of sugar against flour.
7 cl, 8 dwg, 1 tbl, 2 ex
