CARRIER FOR DUMP TRANSFER OF SEMICONDUCTOR WAFERS Russian patent published in 2009 - IPC H01L21/677 

FIELD: electrical engineering.

SUBSTANCE: present invention relates to devices for holding semiconductor wafers during transfer in the manufacturing process. The carrier for dump transfer of semiconductor wafers is made from four fluoroplastic rods. Two lateral rods are placed on the sides of semiconductor wafers in the carrier and one bottom rod, which acts at the bottom of the carrier, is placed below the semiconductor wafers in the carrier. Lateral rods are placed such that, their longitudinal axes and centres of wafers in the carrier lie in the same plane. Slots for fitting-in the semiconductor wafers are brought together such that they lie in the same vertical plane, and are made for holding wafers in this plane, perpendicular the axis of the rods. Slots in both lateral rods have a flat-topped shape. The fasteners at the ends of the rods are made with possibility of fastening, after putting the semiconductor wafers in the carrier, the fourth rod, acting as the cover. The fourth rod is also made with slots, coinciding with the slots in the lateral and bottom rods. The shape of slots in the fourth rod is a mirror reflection of the shape of slots in the bottom rod for holding the wafers during transfer.

EFFECT: invention prevents loss of wafers during transfer due to prevention of wafers getting stuck in the slots.