FIELD: electrical engineering.
SUBSTANCE: cassette for group transportation of semiconductor plates contains four fluoroplastic rods with slots and two fixtures at the rods butt-ends; each of the four rods represents a fluoroplastic tube with a dense rubber insert along the whole of the tube length; the tube wall thickness is equal to (30-40)% of the slots depth that is identical for all the slots; the two side rods are positioned on the sides of the semiconductor plates as may be placed inside the cassette; one lower rod, playing the role of the cassette bottom, is positioned below the semiconductor plates as may be placed inside the cassette; the cross-section of the slots in the side rods is "П"-shaped; the side rods width exceeds the plate thickness by 50-70%, the side slots depth exceeds their width 2-4.5 times; the cross-section slots in the lower rod for plates placement is shaped as a semicircle with a radius amounting to 0.6-0.8 of the plate thickness; the fourth rod also has slots, their shape representing mirror reflection of that of the slots made in the lower rod to ensure plates fixation in the course of transportation; the slots in the fluoroplastic tube and the rubber insert of each rod are made simultaneously in the course of a single cutting operation.
EFFECT: exclusion of plates losses during transportation operations, simultaneous acceleration and handling freedom enhancement.
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CASSETTE FOR GROUP TRANSPORTATION OF SEMICONDUCTOR PLATES | 2012 |
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Authors
Dates
2013-06-20—Published
2012-03-06—Filed